ACTEL A40MX04 PDF

Order Microsemi Corporation A40MXPLG44 (ND) at DigiKey. Check stock and pricing, view product specifications, and order online. Actel A40MXPL84 (A40MX04PL84): FPGA 40MX Family 6K Gates Cells 83MHz/MHz um (CMOS) Technology V/5V Pin PLCC. 39 products offers 39 actel a40mx04 products. About 46% of these are integrated circuits. A wide variety of actel a40mx04 options are available to.

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Actel A40mx04, Actel A40mx04 Suppliers and Manufacturers at

Please enter 5 or 9 numbers for the ZIP Code. Get an immediate offer. See the seller’s listing for full details. Delivery times may vary, especially during peak periods. Contact the seller – opens in a new window or tab and request a shipping method to your location.

Email to friends Share on Facebook – opens in a new window or tab Share on Twitter – opens in a new window or tab Share on Pinterest – opens in a new window or tab Add to watch list. Decapsulation inspection is a process of verifying the manufacturer die to ensure that it is the correct one. Characteristics are the following: Sometimes the die numbers and markings can be confirmed with the devices external markings. For additional information, see the Global Shipping Program terms and conditions – opens in a new window or tab This amount includes applicable customs duties, taxes, brokerage and other fees.

People who viewed this item also viewed. Add to watch list. This image is the top view of an Actel A40MXF device This is the bottom view of an Actel A40MXF device Device is put inside a Nisene Jetetch Pro machine to chemically etch a small cavity inside the Actel A40MXF device to expose die After de-lid process is completed you will see bond wires and die located in the midle of this device This image is a size comparison of a device and internal die Markings on the die are not visible without a microscope.

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There are many terms used for this process in electronic components industry. Learn more – opens in new window or tab. This creates a cavity in a device exposing bonding wires, internal structure, and the die. Add to watch list Remove from watch list Watch list is full Longtime member Free local pickup Shipping: Add to watch list Remove from watch list. Please enter a number less than or equal to Sell now – Have one to sell?

Mouse over to Zoom – Click to enlarge. This mixture is the forced into a small hole in a gasket to etch away polymer encapsulants or exterior of a device using a Nisene Technologies Jetetch Pro decapsulation machine.

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See other items More Minimum monthly payments are required. After the die is exposed, the device is put under a microscope to see if the Manufacturer logo and any markings are visible. Add to cart – Best Offer: For additional information, see the Global Shipping Program terms and conditions – opens in a new window or tab. Refer to eBay Return policy for more details. Any international shipping and import charges are paid in part to Pitney Bowes Inc.

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Learn More – opens in a new window or tab Any international shipping is paid in part to Pitney Bowes Inc. Read more about the condition.

When the manufacture logo and markings are found. Markings on the die are not visible without a microscope.

IC A40mx04-vq80 ACTEL 40mx04vq80 A40MX04VQ80

Packaging should be the same as what is found in a retail store, unless the item is handmade or was packaged by the manufacturer in non-retail packaging, such as an unprinted box or plastic bag. No additional import charges at delivery! A brand-new, unused, unopened, undamaged item in its original packaging where packaging is applicable. Moscow, Moscow, Russian Federation. Make Offer – Loading Learn More – opens in a new window or tab Any international shipping and import charges are paid in part to Pitney Bowes Inc.

There are 82 items available. Learn More – opens in a new window or tab Returns: Visit eBay’s page on international trade. At Global Electronics Testing Services we have many different methods to expose the die.

IC A40mxvq80 ACTEL 40mx04vq80 A40MX04VQ80 | eBay

Shipping cost cannot be calculated. Image not available Photos not available for this variation. After de-lid process is completed you will see bond wires and die located a4mx04 the midle of this device.